ELECTRONICS POTTING


PRODUCT OVERVIEW

Bond Materials provide high quality Epoxy based Electronic Potting Compound product. The product presents are in fluidity liquid state before curing. The viscosity of the product is different depending on the production process and the material properties. When the potting compound is fully solidified, it can be used for the purpose of waterproof, dust-proof, insulation, heat conduction, secrecy, corrosion resistance, temperature resistance and shock proof.

The products have following main properties:

1. Advantages of both epoxy and asphalts

2. Stable performance within wide temperature range.

3. Waterproof, anti-corrosion,high strength, excellent sealing performance.


APPLICATIONS

Coolbond® EP-407 is The Bond Chemicals’ branded Potting Compound product. It is dual-component product based on epoxy resin modified asphalt. The product cured at room temperature upon application. It has the advantages of both epoxy and asphalt. It has excellent properties of fluidity, water resistance, insulation, low curing shrinkage rate etc and can be used for sealing various of electronic components.


PRODUCTS

APPLICATION GUIDE
1. Mix Component A and B following the specified ratio (Note: the ratio is based on weight, not mass)
2. Seal the unused A and B products properly and store safely;
3. Apply the mixture within specified Application time to avoid incomplete curing and possible heating reaction. Note: the larger volume the more heat will be released from the reaction. It would will raise environment temperature and affect the curing time.
4. Gradually injection the mixture into the targeted area (suggest following the inner wall of the object to reduce bubbles). The potting compound will slowly penetrate into the crevice of the application area. If necessary, injection multiple times to achieve better permeation;
5. Allow Curing Time as specified for room-temp curing or heat up curing to achieve better insulation performance;
6. For a large volume application, perform a trail with a small amount first to confirm the usage and performance.
7. The shelf life of the unopened product is 6 months from the date of production.
 
 


TECHNICAL SPECIFICATION

Product

Mix Ratio

Viscosity on Curing

(CPS/25oC)

Application Time

(min)

Initial Curing Time

(25oC,min)

Appearance on Curing

Hardness on Curing

(D

EP-407

A:B=2:1

5000-6000

60-90

120-130

黑色

60-70


APPLICATION CASES



ELECTRONICS POTTING


PRODUCT OVERVIEW

Bond Materials provide high quality Epoxy based Electronic Potting Compound product. The product presents are in fluidity liquid state before curing. The viscosity of the product is different depending on the production process and the material properties. When the potting compound is fully solidified, it can be used for the purpose of waterproof, dust-proof, insulation, heat conduction, secrecy, corrosion resistance, temperature resistance and shock proof.

The products have following main properties:

1. Advantages of both epoxy and asphalts

2. Stable performance within wide temperature range.

3. Waterproof, anti-corrosion,high strength, excellent sealing performance.


APPLICATIONS

Coolbond® EP-407 is The Bond Chemicals’ branded Potting Compound product. It is dual-component product based on epoxy resin modified asphalt. The product cured at room temperature upon application. It has the advantages of both epoxy and asphalt. It has excellent properties of fluidity, water resistance, insulation, low curing shrinkage rate etc and can be used for sealing various of electronic components.


PRODUCTS

APPLICATION GUIDE
1. Mix Component A and B following the specified ratio (Note: the ratio is based on weight, not mass)
2. Seal the unused A and B products properly and store safely;
3. Apply the mixture within specified Application time to avoid incomplete curing and possible heating reaction. Note: the larger volume the more heat will be released from the reaction. It would will raise environment temperature and affect the curing time.
4. Gradually injection the mixture into the targeted area (suggest following the inner wall of the object to reduce bubbles). The potting compound will slowly penetrate into the crevice of the application area. If necessary, injection multiple times to achieve better permeation;
5. Allow Curing Time as specified for room-temp curing or heat up curing to achieve better insulation performance;
6. For a large volume application, perform a trail with a small amount first to confirm the usage and performance.
7. The shelf life of the unopened product is 6 months from the date of production.
 
 


TECHNICAL SPECIFICATION

Product

Mix Ratio

Viscosity on Curing

(CPS/25oC)

Application Time

(min)

Initial Curing Time

(25oC,min)

Appearance on Curing

Hardness on Curing

(D

EP-407

A:B=2:1

5000-6000

60-90

120-130

黑色

60-70


APPLICATION CASES


Contact us

Service Hotline:400 825 1528

Phone:+86-20-82210601

Fax:+86-20-82210626

Mailbox:sales@gzthebond.com